Product overview
- Product number
- V-1102-SMD/A-L
- Manufacturer
- ASSMANN WSW Components
- Catalog
- Thermal - Heat Sinks
- product description
- HEATSINK TO-263 19.38X25.40MM
Documents and media
- Datasheets
- V-1102-SMD/A-L
Product Details
- Attachment Method :
- SMD Pad
- Diameter :
- -
- Material :
- Copper
- Material Finish :
- Tin
- Package Cooled :
- TO-263 (D²Pak)
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- -
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 23.00°C/W @ 300 LFM
- Thermal Resistance @ Natural :
- 11.00°C/W
- Type :
- Top Mount
product description
HEATSINK TO-263 19.38X25.40MM
Purchases and prices
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