Product overview
- Product number
- HSB02-101007
- Manufacturer
- CUI Devices
- Catalog
- Thermal - Heat Sinks
- product description
- HEAT SINK, BGA, 10 X 10 X 7 MM
Documents and media
- Datasheets
- HSB02-101007
Product Details
- Attachment Method :
- Adhesive
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 2.0W @ 75°C
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 16.50°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 37.90°C/W
- Type :
- Top Mount
product description
HEAT SINK, BGA, 10 X 10 X 7 MM
Purchases and prices
Recommended Products
You may be looking for
RBM10DSAN
1825Y0160153KCR
1825Y0250561JCT
WA10-09-10
306-015-400-103
333-028-556-207
1569-18-1-0500-012-1-TS
D38999/26WD18BN
6719 SL005
337-043-523-607
1825Y0160335JXR
C2117A.21.01
1825Y0100391GCR
D38999/26WC8AC
C48-06R8-3S6-106
D38999/20FC98SA-LC
RSM11DSXH
1825Y0160153KXR
1825Y0250561KCR
WA10-08-10
