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Product overview

Product number
374324B60023G
Manufacturer
Aavid
Catalog
Thermal - Heat Sinks
product description
BGA HEAT SINK

Documents and media

Datasheets
374324B60023G

Product Details

Attachment Method :
Solder Anchor
Diameter :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
BGA, FPGA
Part Status :
Active
Power Dissipation @ Temperature Rise :
1.5W @ 50°C
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
6.00°C/W @ 500 LFM
Thermal Resistance @ Natural :
30.60°C/W
Type :
Board Level

product description

BGA HEAT SINK

Purchases and prices

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