Product overview
- Product number
- BDN11-3CB/A01
- Manufacturer
- CTS Corporation
- Catalog
- Thermal - Heat Sinks
- product description
- HEATSINK CPU W/ADHESIVE 1.11"SQ
Documents and media
- Datasheets
- BDN11-3CB/A01
Product Details
- Attachment Method :
- Thermal Tape, Adhesive (Included)
- Diameter :
- -
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- -
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 7.20°C/W @ 400 LFM
- Thermal Resistance @ Natural :
- 20.90°C/W
- Type :
- Top Mount
product description
HEATSINK CPU W/ADHESIVE 1.11"SQ
