Product overview
- Product number
- 303M
- Manufacturer
- Wakefield Thermal
- Catalog
- Thermal - Heat Sinks
- product description
- HEATSINK COMPACT
Documents and media
- Datasheets
- 303M
Product Details
- Attachment Method :
- Press Fit
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- Stud Mounted Semiconductor Cases
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 15.0W @ 37°C
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 1.30°C/W @ 250 LFM
- Thermal Resistance @ Natural :
- -
- Type :
- Board Level, Vertical
product description
HEATSINK COMPACT
