Product overview
- Product number
- HSE-B254-04H
- Manufacturer
- CUI Devices
- Catalog
- Thermal - Heat Sinks
- product description
- HEAT SINK, EXTRUSION, TO-220/TO-
Documents and media
- Datasheets
- HSE-B254-04H
Product Details
- Attachment Method :
- PC Pin
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-218, TO-220
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 4.7W @ 75°C
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 4.93°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 15.96°C/W
- Type :
- Board Level
product description
HEAT SINK, EXTRUSION, TO-220/TO-
