Product overview
- Product number
- HSE-B500-04H
- Manufacturer
- CUI Devices
- Catalog
- Thermal - Heat Sinks
- product description
- HEAT SINK, EXTRUSION, TO-220, 50
Documents and media
- Datasheets
- HSE-B500-04H
Product Details
- Attachment Method :
- PC Pin
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-220
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 12.2W @ 75°C
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 2.88°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 8.05°C/W
- Type :
- Board Level, Vertical
product description
HEAT SINK, EXTRUSION, TO-220, 50
Purchases and prices
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