Product overview
- Product number
- HSS14-B20-NP
- Manufacturer
- CUI Devices
- Catalog
- Thermal - Heat Sinks
- product description
- HEAT SINK, STAMPING, TO-220, 19.
Documents and media
- Datasheets
- HSS14-B20-NP
Product Details
- Attachment Method :
- -
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-220
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 3.1W @ 75°C
- Shape :
- Rectangular
- Thermal Resistance @ Forced Air Flow :
- 11.60°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 23.91°C/W
- Type :
- Board Level, Vertical
product description
HEAT SINK, STAMPING, TO-220, 19.
