Product overview
- Product number
- SIP050-1X27-157BLF
- Manufacturer
- Amphenol Communication Solutions
- Catalog
- Sockets for ICs, Transistors
- product description
- CONN SOCKET SIP 27POS TIN
Documents and media
- Datasheets
- SIP050-1X27-157BLF
Product Details
- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 200.0µin (5.08µm)
- Contact Finish Thickness - Post :
- 200.0µin (5.08µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Closed Frame
- Housing Material :
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 27 (1 x 27)
- Operating Temperature :
- -
- Part Status :
- Obsolete
- Termination :
- Solder
- Type :
- SIP
product description
CONN SOCKET SIP 27POS TIN
