Product overview
- Product number
- SIP1X08-014BLF
- Manufacturer
- Amphenol Communication Solutions
- Catalog
- Sockets for ICs, Transistors
- product description
- CONN SOCKET SIP 8POS TIN
Documents and media
- Datasheets
- SIP1X08-014BLF
Product Details
- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 150.0µin (3.81µm)
- Contact Finish Thickness - Post :
- 200.0µin (5.08µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Closed Frame
- Housing Material :
- Polyphenylene Sulfide (PPS), Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 8 (1 x 8)
- Operating Temperature :
- -
- Part Status :
- Obsolete
- Termination :
- Solder
- Type :
- SIP
product description
CONN SOCKET SIP 8POS TIN
Purchases and prices
Recommended Products
You may be looking for
D38999/26KF18SE
DTS24F25-04SN [V001]
TMMH-113-01-L-D-RA-ES-001
QSE-028-01-H-D-DP-A-RT1
FX6A-100S-0.8SV
25QHM572C0.25-13.560
DTS23H11-13SA
3QHM572D2.0-65.667
TMMH-110-05-L-DV-EC
25QHM572C1.0-109.620
TMMH-111-01-L-Q
TMMH-108-06-F-D-008
DF17(2.0)-20DP-0.5V(51)
3QHM572D2.0-28.6363
2332-20FG00DPT2-S
YACT24MF11JE000000
CTVS07RF-25-37PD
FRCIR06CF-40A-35P-F80-T96
TMMH-113-01-L-DV-EBC
QSE-040-01-H-D-EM2-GP
