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Product overview

Product number
24-3552-16
Manufacturer
Aries Electronics, Inc.
Catalog
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET ZIF 24POS

Documents and media

Datasheets
24-3552-16

Product Details

Contact Finish - Mating :
Nickel Boron
Contact Finish - Post :
Nickel Boron
Contact Finish Thickness - Mating :
50.0µin (1.27µm)
Contact Finish Thickness - Post :
50.0µin (1.27µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyphenylene Sulfide (PPS), Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
24 (2 x 12)
Operating Temperature :
-
Part Status :
Active
Termination :
Solder

product description

CONN IC DIP SOCKET ZIF 24POS

Purchases and prices

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