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Product overview

Product number
550-10-600M35-001166
Manufacturer
Preci-Dip
Catalog
Sockets for ICs, Transistors
product description
BGA PIN ADAPTER 1.27MM SMD

Documents and media

Product Details

Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Finish Thickness - Post :
10.0µin (0.25µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Closed Frame
Housing Material :
FR4 Epoxy Glass
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
600 (35 x 35)
Operating Temperature :
-55°C ~ 125°C
Part Status :
Active
Termination :
Solder
Type :
BGA

product description

BGA PIN ADAPTER 1.27MM SMD

Purchases and prices

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