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Product overview

Product number
30-6621-30
Manufacturer
Aries Electronics, Inc.
Catalog
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET 30POS TIN

Documents and media

Datasheets
30-6621-30

Product Details

Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
200.0µin (5.08µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Phosphor Bronze
Contact Material - Post :
Phosphor Bronze
Features :
Closed Frame
Housing Material :
Polyamide (PA46), Nylon 4/6, Glass Filled
Mounting Type :
Through Hole, Bottom Entry; Through Board
Number of Positions or Pins (Grid) :
30 (2 x 15)
Operating Temperature :
-55°C ~ 105°C
Part Status :
Active
Termination :
Solder

product description

CONN IC DIP SOCKET 30POS TIN

Purchases and prices

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