Product overview
- Product number
- 32-6553-11
- Manufacturer
- Aries Electronics, Inc.
- Catalog
- Sockets for ICs, Transistors
- product description
- CONN IC DIP SOCKET ZIF 32POS
Documents and media
- Datasheets
- 32-6553-11
Product Details
- Contact Finish - Mating :
- Nickel Boron
- Contact Finish - Post :
- Nickel Boron
- Contact Finish Thickness - Mating :
- 50.0µin (1.27µm)
- Contact Finish Thickness - Post :
- 50.0µin (1.27µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polyphenylene Sulfide (PPS), Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 32 (2 x 16)
- Operating Temperature :
- -
- Part Status :
- Active
- Termination :
- Solder
product description
CONN IC DIP SOCKET ZIF 32POS
