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Product overview

Product number
24-516-11M
Manufacturer
Aries Electronics, Inc.
Catalog
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET ZIF 24POS GLD

Documents and media

Datasheets
24-516-11M

Product Details

Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Finish Thickness - Post :
10.0µin (0.25µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyamide (PA46), Nylon 4/6, Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
24 (2 x 12)
Operating Temperature :
-
Part Status :
Active
Termination :
Solder
Type :
DIP, ZIF (ZIP)

product description

CONN IC DIP SOCKET ZIF 24POS GLD

Purchases and prices

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