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Product overview

Product number
19-0508-30
Manufacturer
Aries Electronics, Inc.
Catalog
Sockets for ICs, Transistors
product description
CONN SOCKET SIP 19POS GOLD

Documents and media

Datasheets
19-0508-30

Product Details

Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
-
Housing Material :
Polyamide (PA46), Nylon 4/6
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
19 (1 x 19)
Operating Temperature :
-55°C ~ 105°C
Part Status :
Active
Pitch - Post :
-
Termination :
Wire Wrap
Type :
SIP

product description

CONN SOCKET SIP 19POS GOLD

Purchases and prices

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