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Product overview

Product number
228-1277-00-0602J
Manufacturer
WEC
Catalog
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET ZIF 28POS GLD

Documents and media

Datasheets
228-1277-00-0602J

Product Details

Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish Thickness - Post :
30.0µin (0.76µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polysulfone (PSU), Glass Filled
Mounting Type :
Connector
Number of Positions or Pins (Grid) :
28 (2 x 14)
Operating Temperature :
-55°C ~ 125°C
Part Status :
Active
Termination :
Press-Fit

product description

CONN IC DIP SOCKET ZIF 28POS GLD

Purchases and prices

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