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Product overview

Product number
DILB40P-223TLF
Manufacturer
Amphenol Communication Solutions
Catalog
Sockets for ICs, Transistors
product description
CONN IC DIP SOCKET 40POS TIN

Documents and media

Datasheets
DILB40P-223TLF

Product Details

Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
100.0µin (2.54µm)
Contact Finish Thickness - Post :
100.0µin (2.54µm)
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Open Frame
Housing Material :
Polyamide (PA), Nylon
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
40 (2 x 20)
Operating Temperature :
-55°C ~ 105°C
Part Status :
Active
Termination :
Solder

product description

CONN IC DIP SOCKET 40POS TIN

Purchases and prices

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