Product overview
- Product number
- NC191LTA250
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- SMOOTH FLOW LOW TEMP SOLDER PAST
Documents and media
- Datasheets
- NC191LTA250
Product Details
- Composition :
- Bi57Sn42Ag1 (57/42/1)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 8.8 oz (250g)
- Melting Point :
- 279°F (137°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- -
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 46°F (3°C ~ 8°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
SMOOTH FLOW LOW TEMP SOLDER PAST
Purchases and prices
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