Product overview
- Product number
- S200
- Manufacturer
- Chemtronics
- Catalog
- Solder
- product description
- POCKET SOLDER LEAD-FREE SAC 305
Documents and media
- Datasheets
- S200
Product Details
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Flux Type :
- Rosin Activated (RA)
- Form :
- Tube
- Melting Point :
- 423 ~ 424°F (217 ~ 218°C)
- Mesh Type :
- -
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 60 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- -
- Type :
- Wire Solder
- Wire Gauge :
- 18 AWG, 19 SWG
product description
POCKET SOLDER LEAD-FREE SAC 305