Product overview
- Product number
- TS391SNL250
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- THERMALLY STABLE SOLDER PASTE NO
Documents and media
- Datasheets
- TS391SNL250
Product Details
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 8.8 oz (250g)
- Melting Point :
- 423 ~ 428°F (217 ~ 220°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 68°F ~ 77°F (20°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
THERMALLY STABLE SOLDER PASTE NO
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