Documents and media
- Datasheets
- 70-1506-1510
Product Details
- Composition :
- Sn96.3Ag3.7 (96.3/3.7)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 430 ~ 444°F (221 ~ 223°C)
- Mesh Type :
- 3
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 4 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 32°F ~ 50°F (0°C ~ 10°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
SOLDER PASTE NO CLEAN 500GM
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