Documents and media
- Datasheets
- 70-3205-1812
Product Details
- Composition :
- Sn99Cu0.7Ag0.3 (99/0.7/0.3)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Cartridge, 35.27 oz (1kg)
- Melting Point :
- -
- Mesh Type :
- -
- Part Status :
- Obsolete
- Process :
- Lead Free
- Shelf Life :
- 8 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 32°F ~ 50°F (0°C ~ 10°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
SOLDER PASTE NXG1 NO CLEAN 1000G
