Documents and media
- Datasheets
- 70-3205-1810
Product Details
- Composition :
- Sn99.3Cu0.7 (99.3/0.7)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 441°F (227°C)
- Mesh Type :
- -
- Part Status :
- Obsolete
- Process :
- Lead Free
- Shelf Life :
- 8 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 32°F ~ 50°F (0°C ~ 10°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
SOLDER PASTE NXG1 NO CLEAN 500GM
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