Documents and media
- Datasheets
- 70-3205-1810
Product Details
- Composition :
- Sn99.3Cu0.7 (99.3/0.7)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 441°F (227°C)
- Mesh Type :
- -
- Part Status :
- Obsolete
- Process :
- Lead Free
- Shelf Life :
- 8 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 32°F ~ 50°F (0°C ~ 10°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
SOLDER PASTE NXG1 NO CLEAN 500GM
Purchases and prices
Recommended Products
You may be looking for
887-040-500-107
HC1812CG273J251
842-039-542-107
SMCJ5655E3/TR13
USS004SC2DMC40
SMCG6070/TR13
FFSD-05-D-100.00-01-N
807-026-541-104
SFSDT-20-28-G-17.00-DS-NDX
SMCG5665A/TR13
GMC32CG472J200NT
FFSD-25-D-04.25-01-N-D02
GRM1555C1H300JZ01D
807-025-521-112
30KPA28-B
HC1812CG220J501
887-040-500-608
GMC55Z5U106Z25NT
842-039-520-108
SMCJ5656/TR13
