Product overview
- Product number
- SMDSW.031 1LB
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- SOLDER WIRE 63/37 TIN/LEAD NO-CL
Documents and media
- Datasheets
- SMDSW.031 1LB
Product Details
- Composition :
- Sn63Pb37 (63/37)
- Flux Type :
- No-Clean, Water Soluble
- Form :
- Spool, 1 lb (454 g)
- Melting Point :
- 361°F (183°C)
- Mesh Type :
- -
- Part Status :
- Active
- Process :
- Leaded
- Shelf Life :
- -
- Shelf Life Start :
- -
- Storage/Refrigeration Temperature :
- -
- Type :
- Wire Solder
- Wire Gauge :
- 20 AWG, 22 SWG
product description
SOLDER WIRE 63/37 TIN/LEAD NO-CL
Purchases and prices
Recommended Products
You may be looking for
C0619E-AUDIT-35U-12X18
PLA-BLA-01
RN73C2A57R6BTG
GMS20F-20
DYMO-23.9-9
PE-68624NL
S1-0R2J8
KAI-08050-ABA-JP-BA
WSL2816R0150FEK
1112-02-0519
RG2012V-7320-W-T1
PE7AP418-30
AR0134CSSM25SUEA0-DRBR1
619-40-10-10-00-NYU-TR
R411811124
KAI-16000-AXA-JP-B1
C1012E-AUDIT-35U-12X18
RM-NY0010
RN73C2A590RBTG
GMS20F-5
