Product overview
- Product number
- 4900P-250G
- Manufacturer
- MG Chemicals
- Catalog
- Solder
- product description
- LEADED NO CLEAN SOLDER PASTE
Documents and media
- Datasheets
- 4900P-250G
Product Details
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 8.8 oz (250g)
- Melting Point :
- 423 ~ 430°F (217 ~ 221°C)
- Mesh Type :
- -
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 24 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 35°F ~ 50°F (2°C ~ 10°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
LEADED NO CLEAN SOLDER PASTE
