Product overview
- Product number
- TS991AX500T4
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- SOLDER PASTE THERMALLY STABLE NC
Documents and media
- Datasheets
- TS991AX500T4
Product Details
- Composition :
- Sn63Pb37 (63/37)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 361°F (183°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Leaded
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- -
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
SOLDER PASTE THERMALLY STABLE NC
Purchases and prices
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