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Product overview

Product number
SMDSWLF.006 2G
Manufacturer
Chip Quik, Inc.
Catalog
Solder
product description
SOLDER WIRE SN96.5/AG3/CU0.5

Documents and media

Datasheets
SMDSWLF.006 2G

Product Details

Composition :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Flux Type :
No-Clean, Water Soluble
Form :
Spool, 0.07 oz (2g)
Melting Point :
423 ~ 428°F (217 ~ 220°C)
Mesh Type :
-
Part Status :
Active
Process :
Lead Free
Shelf Life :
-
Shelf Life Start :
-
Storage/Refrigeration Temperature :
-
Type :
Wire Solder
Wire Gauge :
-

product description

SOLDER WIRE SN96.5/AG3/CU0.5

Purchases and prices

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