Product overview
- Product number
- SMDSWLF.006 2G
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- SOLDER WIRE SN96.5/AG3/CU0.5
Documents and media
- Datasheets
- SMDSWLF.006 2G
Product Details
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Flux Type :
- No-Clean, Water Soluble
- Form :
- Spool, 0.07 oz (2g)
- Melting Point :
- 423 ~ 428°F (217 ~ 220°C)
- Mesh Type :
- -
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- -
- Shelf Life Start :
- -
- Storage/Refrigeration Temperature :
- -
- Type :
- Wire Solder
- Wire Gauge :
- -
product description
SOLDER WIRE SN96.5/AG3/CU0.5