Product overview
- Product number
- WS991SNL500T4
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- SOLDER PASTE THERMALLY STABLE WS
Documents and media
- Datasheets
- WS991SNL500T4
Product Details
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- Water Soluble
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 423°F (217°C)
- Mesh Type :
- 4
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 6 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- -
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
SOLDER PASTE THERMALLY STABLE WS
Purchases and prices
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