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Product overview

Product number
EXB-SN96.5AG3.0CU0.5-0.5LB
Manufacturer
Chip Quik, Inc.
Catalog
Solder
product description
SOLDER BAR SN96.5/AG3.0/CU0.5 0.

Documents and media

Product Details

Composition :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter :
-
Flux Type :
-
Form :
Bar, 0.5 lb (227g)
Melting Point :
423 ~ 428°F (217 ~ 220°C)
Mesh Type :
-
Part Status :
Active
Process :
Leaded
Shelf Life :
-
Shelf Life Start :
-
Storage/Refrigeration Temperature :
-
Type :
Bar Solder
Wire Gauge :
-

product description

SOLDER BAR SN96.5/AG3.0/CU0.5 0.

Purchases and prices

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