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Product overview

Product number
TS391SNL500C
Manufacturer
Chip Quik, Inc.
Catalog
Solder
product description
THERMALLY STABLE SOLDER PASTE NO

Documents and media

Datasheets
TS391SNL500C

Product Details

Composition :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter :
-
Flux Type :
No-Clean
Form :
Cartridge, 17.64 oz (500g)
Melting Point :
423 ~ 428°F (217 ~ 220°C)
Mesh Type :
4
Part Status :
Active
Process :
Lead Free
Shelf Life :
12 Months
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
68°F ~ 77°F (20°C ~ 25°C)
Type :
Solder Paste
Wire Gauge :
-

product description

THERMALLY STABLE SOLDER PASTE NO

Purchases and prices

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