Product overview
- Product number
- BGA0034-S
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder Stencils, Templates
- product description
- BGA-676 (1.0 MM PITCH, 26 X 26 G
Documents and media
- Datasheets
- BGA0034-S
Product Details
- Material :
- Stainless Steel
- Number of Positions :
- 676
- Part Status :
- Active
- Thermal Center Pad :
- -
- Type :
- BGA
product description
BGA-676 (1.0 MM PITCH, 26 X 26 G
Purchases and prices
Recommended Products
You may be looking for
MA1.5KE300AE3
TCSD-05-D-10.00-01-R
845-122-560-207
895-052-521-403
FFMD-10-T-02.10-01-N
MA1.5KE75CAE3
IDSS-14-S-20.00
TCMD-16-D-04.00-01-R
15KPA36AE3/TR13
1825J5000562FCT
CCR05CG821GS
1808J0160183FCT
CCR05CJ5R6BRVTR2\1K
845-052-541-608
MA1.5KE68A
MA1.5KE350A
TCSD-12-D-05.00-01-F-N-SR
845-128-559-503
896-048-558-612
FFSD-05-D-06.00-01-F-N
