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Product overview

Product number
BMI-C-001-SN
Manufacturer
Laird - Performance Materials
Catalog
RFI and EMI - Contacts, Fingerstock and Gaskets
product description
SP CON S SN TNR

Documents and media

Datasheets
BMI-C-001-SN

Product Details

Attachment Method :
Solder
Material :
Beryllium Copper
Operating Temperature :
-
Part Status :
Active
Plating :
Tin
Plating - Thickness :
-
Shape :
-
Type :
Shield Finger

product description

SP CON S SN TNR

Purchases and prices

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