- Manufacturer：
-
- 3M (22)
- Bergquist / Henkel (23)
- CUI Devices (12)
- Ohmite (7)
- Rathbun (5)
- Würth Elektronik (5)
- Part Status：
-
- Material：
-
- Type：
-
- Usage：
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- Adhesive：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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92 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
67
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 15MMX30M... |
1 |
15
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 41.25MMX4... |
1 |
7
In-stock
|
Get Quote | ||
|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
486
In-stock
|
Get Quote | ||
|
|
3M | THERMALLY COND A... |
1 |
3
In-stock
|
Get Quote | ||
|
|
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
5
In-stock
|
Get Quote | ||
|
|
3M | THERMALLY COND A... |
1 |
24
In-stock
|
Get Quote | ||
|
|
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
5
In-stock
|
Get Quote | ||
|
|
3M | THERMALLY COND A... |
1 |
4
In-stock
|
Get Quote | ||
|
|
Bergquist / Henkel | BERGQUIST GAP PA... |
1 |
6
In-stock
|
Get Quote | ||
|
|
3M | THERMALLY COND A... |
1 |
5
In-stock
|
Get Quote | ||
|
|
Power Components Sales LLC | Polyimide Supported Silicon... |
1 |
15
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
4
In-stock
|
Get Quote | ||
|
|
Power Components Sales LLC | ULTRA SOFT SILIC... |
1 |
10
In-stock
|
Get Quote | ||
|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Bergquist / Henkel | BERGQUIST GAP PA... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Bergquist / Henkel | BERGQUIST GAP PA... |
1 |
3,000
In-stock
|
Get Quote |
