- Manufacturer:
-
- Adafruit (1)
- CUI Devices (52)
- Leader Tech Inc. (10)
- Ohmite (7)
- Parker Chomerics (2)
- Shiu Li Technology (32)
- T-Global Technology (200)
- Taica Corporation (16)
- Part Status:
-
- Material:
-
- Type:
-
- Shape:
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- Usage:
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- Outline:
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- Thermal Resistivity:
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492 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
T-Global Technology | THERMAL PAD 10X5MM... |
1 |
2,098
In-stock
|
Get Quote | |||
T-Global Technology | THERMAL PAD 10X5MM... |
1 |
1,625
In-stock
|
Get Quote | |||
T-Global Technology | THERMAL PAD 9.5X9.5... |
1 |
1,496
In-stock
|
Get Quote | |||
T-Global Technology | THERMAL PAD 20X10M... |
1 |
1,300
In-stock
|
Get Quote | |||
T-Global Technology | THERMAL PAD 33.9X33... |
1 |
139
In-stock
|
Get Quote | |||
T-Global Technology | THERMAL PAD 30X30M... |
1 |
165
In-stock
|
Get Quote | |||
T-Global Technology | THERMAL PAD 25X20M... |
1 |
390
In-stock
|
Get Quote | |||
Taica Corporation | THERMAL INTERFAC... |
1 |
113
In-stock
|
Get Quote | |||
CUI Devices | THERM PAD 20MMX20M... |
1 |
281
In-stock
|
Get Quote | |||
T-Global Technology | SILICONE THERMAL... |
1 |
65
In-stock
|
Get Quote | |||
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
39
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
93
In-stock
|
Get Quote | |||
T-Global Technology | SILICONE THERMAL... |
1 |
8
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
20
In-stock
|
Get Quote | |||
CUI Devices | THERM PAD 20MMX40M... |
1 |
72
In-stock
|
Get Quote | |||
CUI Devices | THERM PAD 50MMX50M... |
1 |
66
In-stock
|
Get Quote | |||
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
57
In-stock
|
Get Quote | |||
T-Global Technology | THERMAL PAD 5X5MM... |
1 |
13,178
In-stock
|
Get Quote | |||
CUI Devices | THERM PAD 15MMX15M... |
1 |
31
In-stock
|
Get Quote | |||
T-Global Technology | THERMAL PAD 10X5MM... |
1 |
1,121
In-stock
|
Get Quote |