- Manufacturer:
-
- CUI Devices (13)
- Jones Tech (5)
- Leader Tech Inc. (4)
- Shiu Li Technology (52)
- Part Status:
-
- Material:
-
- Type:
-
- Outline:
-
- Backing, Carrier:
-
- Thermal Resistivity:
-
163 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Wakefield Thermal | THERM PAD 101.6MMX1... |
1 |
101
In-stock
|
Get Quote | |||
Wakefield Thermal | THERM PAD 101.6MMX1... |
1 |
106
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
79
In-stock
|
Get Quote | |||
Wakefield Thermal | THERM PAD 25.4MMX25... |
1 |
219
In-stock
|
Get Quote | |||
Wakefield Thermal | THERM PAD 25.4MMX25... |
1 |
245
In-stock
|
Get Quote | |||
Wakefield Thermal | THERM PAD 101.6MMX1... |
1 |
125
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
48
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
31
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
13
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
3,000
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
109
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 457.2MMX4... |
1 |
3,000
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
78
In-stock
|
Get Quote | |||
Wakefield Thermal | THERM PAD 25.4MMX25... |
1 |
98
In-stock
|
Get Quote | |||
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
32
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
22
In-stock
|
Get Quote | |||
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
23
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
319
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
6
In-stock
|
Get Quote | |||
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
124
In-stock
|
Get Quote |