- Manufacturer：
-
- Bergquist / Henkel (19)
- CUI Devices (52)
- Leader Tech Inc. (6)
- Ohmite (7)
- Shiu Li Technology (31)
- T-Global Technology (226)
- Part Status：
-
- Material：
-
- Type：
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- Shape：
-
- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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411 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | THERMAL PAD 10X5MM... |
1 |
2,098
In-stock
|
Get Quote | ||
|
|
T-Global Technology | THERMAL PAD 10X5MM... |
1 |
1,625
In-stock
|
Get Quote | ||
|
|
T-Global Technology | THERMAL PAD 9.5X9.5... |
1 |
1,496
In-stock
|
Get Quote | ||
|
|
T-Global Technology | THERMAL PAD 20X10M... |
1 |
1,300
In-stock
|
Get Quote | ||
|
|
T-Global Technology | THERMAL PAD 33.9X33... |
1 |
139
In-stock
|
Get Quote | ||
|
|
T-Global Technology | THERMAL PAD 30X30M... |
1 |
165
In-stock
|
Get Quote | ||
|
|
T-Global Technology | THERMAL PAD 25X20M... |
1 |
390
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 20MMX20M... |
1 |
281
In-stock
|
Get Quote | ||
|
|
T-Global Technology | SILICONE THERMAL... |
1 |
65
In-stock
|
Get Quote | ||
|
|
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
39
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
93
In-stock
|
Get Quote | ||
|
|
T-Global Technology | SILICONE THERMAL... |
1 |
8
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | THERM PAD 228.6MMX2... |
1 |
20
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 20MMX40M... |
1 |
72
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 50MMX50M... |
1 |
66
In-stock
|
Get Quote | ||
|
|
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
57
In-stock
|
Get Quote | ||
|
|
T-Global Technology | THERMAL PAD 5X5MM... |
1 |
13,178
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 15MMX15M... |
1 |
31
In-stock
|
Get Quote | ||
|
|
T-Global Technology | THERMAL PAD 10X5MM... |
1 |
1,121
In-stock
|
Get Quote | ||
|
|
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
43
In-stock
|
Get Quote |
