- Manufacturer：
-
- CUI Devices (39)
- Parker Chomerics (3)
- Shiu Li Technology (120)
- Part Status：
-
- Type：
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- Shape：
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- Usage：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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198 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Parker Chomerics | THERM PAD 14X14MM P... |
1 |
762
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | COOLZORB-ULTRA,0.... |
1 |
2
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 70X70MM 1... |
1 |
32
In-stock
|
Get Quote | ||
|
|
Bergquist / Henkel | THERM PAD 406.4MMX2... |
1 |
715
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 15MMX30M... |
1 |
15
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 20MMX20M... |
1 |
13
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 10MMX10M... |
1 |
11
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 50MMX50M... |
1 |
13
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 41.25MMX4... |
1 |
7
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 15MMX15M... |
1 |
24
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 30MMX30M... |
1 |
15
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF840 |
1 |
3
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF850 |
1 |
2
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF860 |
1 |
3
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF870 |
1 |
4
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF880 |
1 |
2
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF890 |
1 |
2
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF8120 |
1 |
2
In-stock
|
Get Quote | ||
|
|
Laird - Performance Materials | TFLEX SF8130 |
1 |
2
In-stock
|
Get Quote | ||
|
|
Bergquist / Henkel | BERGQUIST GAP PA... |
1 |
6
In-stock
|
Get Quote |
