- Manufacturer：
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- CUI Devices (2)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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14 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 23X18MM S... |
1 |
1
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1 |
122
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 45MM X 45... |
1 |
97
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
687
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
466
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 33MM X 33... |
1 |
28
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X18MM F... |
1 |
86
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X18MM D... |
1 |
85
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 27X15MM F... |
1 |
94
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 27X15MM D... |
1 |
88
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 27X15MM S... |
1 |
66
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 45X45X14.5M... |
10 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 33X33X19.5M... |
10 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X24.5M... |
10 |
3,000
In-stock
|
Get Quote |
