- Package Cooled:
-
- Thermal Resistance @ Forced Air Flow:
-
2 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Apex Microtechnology | HEATSINK 8P TO-3 1.... |
1 |
3,000
In-stock
|
Get Quote | ||
![]() |
Apex Microtechnology | HEATSINK 10P DIP |
1 |
3,000
In-stock
|
Get Quote |