- Material:
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- Type:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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8 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Aavid | BOARD LEVEL HEAT... |
3,000 |
3,000
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
Get Quote | |||
ASSMANN WSW Components | HEATSINK CPU FOR... |
1 |
1,151
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
1 |
825
In-stock
|
Get Quote | |||
Aavid | HEATSINK TO-3 H31.7... |
1 |
600
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK POWER T... |
1 |
46
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
1 |
275
In-stock
|
Get Quote | |||
Ohmite | BGA HEATSINK W/TA... |
1 |
90
In-stock
|
Get Quote |