- Manufacturer：
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- CUI Devices (3)
- Part Status：
-
- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 3.6W... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 30.5MM LOW P HS ASS... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 27MM LOW P HS ASSY... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 30.5MM HS ASSY ULTE... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | 29MM PIN FIN HS AS... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
270 |
3,000
In-stock
|
Get Quote |
