- Manufacturer：
-
- CTS Corporation (3)
- CUI Devices (1)
- Part Status：
-
- Material：
-
- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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17 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
528 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
600 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 HI... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1,280 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
600 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
1 |
100
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
1 |
96
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
84
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TI TAS56... |
1 |
329
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 31X23MM S... |
1 |
98
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 31X23MM F... |
1 |
96
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 31X23MM D... |
1 |
59
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X2... |
10 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
100 |
3,000
In-stock
|
Get Quote |
