- Material:
-
- Type:
-
- Package Cooled:
-
- Attachment Method:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
2 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEATSINK TO-220 6.8W... |
1 |
3,234
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
466
In-stock
|
Get Quote |