- Manufacturer：
-
- Aavid (3)
- CUI Devices (1)
- Ohmite (1)
- WEC (1)
- Part Status：
-
- Material：
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- Shape：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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11 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
3,000 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 HI... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220/TO... |
1 |
911
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 W/T... |
1 |
113
In-stock
|
Get Quote | ||
|
|
WEC | HEAT SINK 1.75" HIG... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK 1.75" HI R... |
1 |
2,062
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
646
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK FOR TO2... |
1 |
342
In-stock
|
Get Quote | ||
|
|
Aavid | HEAT SINK 1.75" HIG... |
1 |
1,289
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
52
In-stock
|
Get Quote |
