- Manufacturer:
-
- CTS Corporation (1)
- CUI Devices (2)
- Part Status:
-
- Material:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
14 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
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CTS Corporation | HEATSINK FORGED ... |
300 |
3,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK FOR TO21... |
1,000 |
3,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK TO-220 VE... |
1 |
3,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK FOR TO21... |
1,000 |
3,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK TO-220 W/S... |
1,000 |
3,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK TO-220 W/S... |
1,000 |
3,000
In-stock
|
Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
1 |
787
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
150 |
600
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK TO-220 VR... |
1 |
8,102
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK 23X15MM F... |
1 |
127
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,991
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK 23X15MM S... |
1 |
88
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK 23X15MM D... |
1 |
8
In-stock
|
Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X19.5M... |
10 |
3,000
In-stock
|
Get Quote |