- Manufacturer：
-
- CTS Corporation (2)
- T-Global Technology (19)
- Wakefield Thermal (12)
- Material：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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33 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
39
In-stock
|
Get Quote | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
1 |
80
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 21MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 25MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 27.9M... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | HEATSINK CER 12X12... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | HEATSINK CER 20X20... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | HEATSINK CER 30.5X... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | HEATSINK CER 32X32... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | HEATSINK CER 43X43... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | HEATSINK CER 60X60... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
T-Global Technology | XL25 CERAMIC 20X20M... |
1 |
3,000
In-stock
|
Get Quote |
