- Manufacturer：
-
- CTS Corporation (3)
- CUI Devices (1)
- Part Status：
-
- Material：
-
- Shape：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,500 |
3,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR .50"H... |
1 |
3,000
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
285
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
2,989
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR HOR... |
1 |
627
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR VER... |
1 |
4,016
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
64
In-stock
|
Get Quote |
