- Manufacturer:
-
- CUI Devices (1)
- Material:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
2 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK TO-263 CO... |
9,000 |
3,000
In-stock
|
Get Quote | |||
TE Connectivity AMP Connectors | HS ASSY CLIP |
1 |
3,000
In-stock
|
Get Quote |