- Manufacturer:
-
- CUI Devices (2)
- WEC (1)
- Material:
-
- Package Cooled:
-
- Attachment Method:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
WEC | HEATSINK TO-220 4.7W... |
47 |
375
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,000 |
3,000
In-stock
|
Get Quote | |||
CUI Devices | HEATSINK TO-220 4.7W... |
1 |
781
In-stock
|
Get Quote |